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Vapor pressure and residual stress effects on failure of an adhesive film

  • Published:2005-08 Issue:16-17 Volume:42 Page:4795-4810
  • ISSN:0020-7683
  • Container-title:International Journal of Solids and Structures
  • language:en
  • Short-container-title:International Journal of Solids and Structures

Author:

Chew H.B.,Guo T.F.,Cheng L.

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation

Reference33 articles.

1. On the mode II popcorn effect in thin packages;Alpern;IEEE Transactions on Components and Packaging Technologies,2002

2. Vapor pressure assisted void growth and cracking of polymeric films and interfaces;Cheng;Interface Science,2003

3. Vapor pressure and residual stress effects on the toughness of polymeric adhesive joints;Chew;Engineering Fracture Mechanics,2004

4. Vapor pressure assisted crack growth at interfaces under mixed mode loading;Chong;Computational Materials Science,2004

5. Finite element simulations of ductile rupture in a constrained metal foil;Chowdhury;Material Science and Engineering A,1995

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