Role of Vapor Pressure on Popcorn Cracking in IC Packages-Reference-Cited by-同舟云学术

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Role of Vapor Pressure on Popcorn Cracking in IC Packages

Published:2014-02-28 Issue:3 Volume:3 Page:20130044
ISSN:2165-3992
Container-title:Materials Performance and Characterization
language:en
Short-container-title:Matls. Perf. Charact.

Author:

Wong W. H.¹,Guo T. F.²,Cheng L.³

Affiliation:

1. Institute of High Performance Computing, Singapore 138632, e-mail: wongwhm@ihpc.a-star.edu.sg

2. Institute of High Performance Computing, Singapore 138632, e-mail: guotf@ihpc.a-star.edu.sg

3. Department of Mechanical Engineering, National Univ. of Singapore, Singapore Singapore 117576, e-mail: mpecl@nus.edu.sg

Publisher

ASTM International

Subject

Metals and Alloys,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process;Microelectronics Reliability;2023-07

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