Interfacial mixed-mode fracture of adhesive bonds undergoing large deformation

Author:

Chai Herzl

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation

Reference33 articles.

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3. Brandenburger, P.D., Pearson, R.A., 1995. Mixed mode fracture of organic chip attachment adhesives. In: Application of Fracture Mechanics in Electronic Packaging and Materials, ASME EEP-Vol. 11/MD-Vol. 64, pp. 179–184

4. Shear fracture;Chai;International Journal of Fracture,1988

5. Interlaminar shear fracture of laminated composites;Chai;International Journal of Fracture,1990

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