Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

Author:

Sundelin Janne J.,Nurmi Sami T.,Lepistö Toivo K.,Ristolainen Eero O.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. C.A. Harper, Electronic Materials and Processes Handbook, 3rd ed. (New York: McGraw-Hill, 2003), p. 588.

2. Y. Fukuda, M.G. Pecht, K. Fukuda, and S. Fukuda, IEEE Trans. Compon. Packag. A 26, 616 (2003).

3. J.S. Hwang, Environment-Friendly Electronics: Lead-Free Technology (Bristol: Electrochemical Publications, 2001), p. 366.

4. J. Yu, D.K. Joo, and S.W. Shin, Acta Mater., 50, 4315 (2002).

5. F. Guo, J. Lee, and K.N. Subramanian, Solder Surf. Mount Technol. 15, 39 (2003).

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