Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s11665-020-04899-3.pdf
Reference37 articles.
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4. I. Kim and S.B. Lee, Fatigue Life Evaluation of Lead-Free Solder Under Thermal and Mechanical Loads, in Proceedings—Electronic Components and Technology Conference, (Reno, NV) (2007), pp. 95–104
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