1. A. Syed, in Electronic Components and Technology Conference (ECTC) (2004), pp. 737–746
2. S. Wiese, E. Meusel, K.J. Wolter, in Electronic Components and Technology Conference (ECTC) (2003), pp. 1997–2006
3. I. Dutta, D. Pan, S. Jadhav, in International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (Euro SimE) (2005), pp. 641–647
4. J.W. Morris, H.G. Song, F. Hua, in Electronic Components and Technology Conference (ECTC) (2003), pp. 54–57
5. M. Kerr, N. Chawla, Acta Mater. 52, 50–54 (2004)