Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi, In and Ti-Reference-Cited by-同舟云学术

Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi, In and Ti

Published:2022-10 Issue:5 Volume:32 Page:643-654
ISSN:1002-0071
Container-title:Progress in Natural Science: Materials International
language:en
Short-container-title:Progress in Natural Science: Materials International

Author:

Chen Youyang,You Kangdong,Yu Shuting,Yang Tixin,Dong Ziqiang,Zhang Jincang,Jia Yandong,Wang Gang,Peng Jubo,Cai Shanshan,Luo Xiaobin,Wang Jiajun,Liu Chen

Publisher

Elsevier BV

Subject

General Materials Science

Reference44 articles.

1. Magnetic nanoparticle-based solder composites for electronic packaging applications

2. Creep failure mechanism and life prediction of lead-free solder joint

3. Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

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