1. B. Bottoms, M. Tsuriya, C. Richardson, iNEMI packaging technology roadmap highlights. (2014) https://doi.org/10.1109/ICEP.2014.6826686
2. R. Aspandiar, K. Byrd, K.K. Tang, L. Campbell, S. Mokler, Investigation of low temperature solders to reduce reflow temperature, improve SMT yields and realize energy savings, in Proceedings of the 2015 APEX Conference, San Diego, CA, February 2015
3. H. Fu, R. Aspandiar, J. Chen, S. Cheng, Q. Chen, R. Coyle, S. Feng, M. Krmpotich, R. Lasky, S. Mokler, iNEMI project on process development of BiSn-based low temperature solder pastes, in Proceedings of the 2017 SMTA International Conference, Rosemont, IL. 2017. pp. 207–220
4. M. Ribas, A. Kumar, D. Kosuri, R.R. Rangaraju, P. Choudhury, S. Telu, S. Sarkar, Low temperature soldering using Sn-Bi alloys, in Proceedings of the 2017 SMTA International Conference, Rosemont, IL. 2017. pp. 201–206
5. T. Laurila, V. Vuorinen, M. Paulasto-Kröckel, Mater Sci Eng R 68, 1 (2010)