Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations-Reference-Cited by-同舟云学术

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Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations

Published:2008-09-16 Issue:12 Volume:37 Page:1858-1862
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Xia Y.H.,Jee Y.K.,Yu J.,Lee T.Y.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0548-7.pdf

Reference19 articles.

1. M. Abtew, G. Selvaduray. Mater. Sci. Eng. Rep. 27, 95 (2000) doi: 10.1016/S0927-796X(00)00010-3

2. K. Suganuma. Curr. Opin. Solid State Mater. Sci. 5, 55 (2001) doi: 10.1016/S1359-0286(00)00036-X

3. B. Ebersberger and R. Bauer, Proceedings of Electronic Components and Technology Conference 2004 (Las Vegas, NV, Jun. 2004), p. 683.

4. H.C. Kim, Proceedings Electronic Components and Technology Conference 2007 (Reno, NV, May 2007), p. 962.

5. D.W. Kim, Proceedings Electronic Components and Technology Conference 2007 (Reno, NV, May 2007), p. 1614.

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1. Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application;Korean Journal of Metals and Materials;2024-04-05

2. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux;Journal of Alloys and Compounds;2017-02

3. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition;Materials;2016-06-28

4. Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method;Journal of Materials Science: Materials in Electronics;2015-07-15

5. Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders;Journal of Alloys and Compounds;2015-01

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