1. National Center for Manufacturing Sciences, “Lead-Free Solder Project Final Report,” NCMS Report 0401RE96, August (1997)
2. Lead-Free Soldering Roadmap Committee of JEITA, “Lead-Free Roadmap 2002,” official version2.1, September (2002)
3. M. Nagano, N. Hidaka, M. Shimoda, and H. Watanabe, Proceedings of New Frontiers of Process Science and Engineering in Advanced Materials (Japan: High Temperature Society of Japan, 2004), pp. 256–261.
4. Mattila, T. T. and Kivilahti, J. K.: J. Electron. Mater. 34, 969–976. (2005)
5. Chuang, T. H. Yen, S. F. and Cheng, M. D.: J. Electron. Mater. 35, 302–309. (2006)