Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading-Reference-Cited by-同舟云学术

Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading

Published:2005-07 Issue:7 Volume:34 Page:969-976
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Mattila T. T.,Kivilahti J. K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0084-7.pdf

Reference28 articles.

1. V. Puligandla, S. Dunford, and J.K. Kivilahti, Reliability Aspects of Lead-Free Solders in Electronic Assemblies, the Handbook of Lead (Pb)-Free Technology for Microelectronics Assemblies, ed. Karl J. Puttliz and Kathleen A. Stalter (New York: Marcel Dekker Inc., 2004), pp. 769–850.

2. Directive 2002/96/EC of European Parliament and the Council on Waste of Electrical and Electronic Equipment (WEEE), 27.1.2003.

3. Directive 2002/96/EC of the European Parliament and the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment/RoHS), 27.1.2003.

4. T.T. Mattila, P. Marjamäki, and J.K. Kivilahti, Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions, (submitted 2005).

5. K. Mishiro, S. Ishikawa, M. Abe, T. Kumai, Y. Higashiguchi, and K. Tsebone, Microelectron. Reliability 42, 77 (2002).

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