Author:
Ramos S. B.,González Lemus N. V.,Deluque Toro C. E.,Cabeza G. F.,Fernández Guillermet A.
Funder
CONICET
Universidad Nacional del Comahue
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference75 articles.
1. H.R. Kotadia, P.D. Howes, and S.H. Mannan, Microelectron. Reliab. 54, 1253 (2014).
2. J.L. Freer and J.W. Morris, J. Electron. Mater. 21, 647 (1992).
3. T. Laurila, V. Vuorinen, and J.K. Kivilahti, Mater. Sci. Eng., R 49, 1 (2005).
4. P.-E. Tegehall, Review of the impact of intermetallic layers on the brittleness of tin-lead and lead-free solder joints. (IVF Project Report 06/07, © IVF Industrial Research and Development Corporation, Sweden),
http://extra.ivf.se/eqs/ dokument/7%20pet6005.pdf
. Accessed 15 Dec 2016.
5. K.N. Tu, Acta Metall. Mater. 21, 347 (1973).
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