Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes-Reference-Cited by-同舟云学术

Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes

Published:2006-02 Issue:2 Volume:35 Page:302-309
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chuang T. H.,Yen S. F.,Cheng M. D.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02692450.pdf

Reference8 articles.

1. K. Zeng and K.N. Tu,Mater. Sci. Eng. R 38, 55 (2002).

2. M. Yamashita, S. Tada, K. Shiokawa, and Fuzi Electric Co., “Solder Alloys,” U.S. patent 6,179,935 B1 (2001).

3. K. Habu, N. Takeda, H. Watanabe, H. Ooki, J. Abe, T. Saito, Y. Taniguchi, and K. Takayama,Proc. Int. Conf. Electron. Environment, (New York: IEEE, 1999), p. 21.

4. C.M. Chuang and K.L. Lin,J. Electron. Mater. 33, 1426 (2003).

5. C.M. Chuang, P.C. Shi, and K.L. Lin,2002 Int. Symp. Electron. Mater. Packag., IEEE, 360 (2002).

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods;International Journal of Materials Research;2012-12-19

2. Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder;Materials Science and Engineering: A;2012-12

3. Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder;Materials Science and Engineering: A;2012-05

4. Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints;Microelectronics Reliability;2012-01

5. An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate;Materials Science and Engineering: A;2011-11