Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics-Reference-Cited by-同舟云学术

Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

Published:2012-05-10 Issue:8 Volume:41 Page:2107-2117
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chidambaram Vivek,Yeung Ho Beng,Shan Gao

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-2114-6.pdf

Reference13 articles.

1. C. Johnston, Proceedings of the International Conference of High-Temperature Electronics (Albuquerque, NM, 2008), p. 000001.

2. S.T. Riches, C. Johnston, M. Sousa, P. Grant, J. Guilliver, M. Langley, R. Pittson, and M. Firmstone, Proceedings of the International Conference of High-Temperature Electronics (Albuquerque, NM, 2008), p. 000265.

3. H. Okamoto, Binary Alloy Phase Diagrams, updating service (Materials Park: ASM International, 1992).

4. V. Chidambaram, J. Hattel, and J. Hald, J. Microelectron. Eng. 88, 6 (2011).

5. J.-W. Nah and K.-W. Paik, IEEE Trans. Compon. Packag. Technol. 25, 1 (2002).

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