Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging-Reference-Cited by-同舟云学术

Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging

Published:2007-09-12 Issue:1 Volume:37 Page:2-8
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hao Hu,Shi Yaowu,Xia Zhidong,Lei Yongping,Guo Fu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0263-9.pdf

Reference21 articles.

1. K. Suganuma, Curr. Opin. Solid St. Mater. 5, 55 (2001)

2. B. Richards and K. Nimmo, An Analysis of the Current Status of Lead-Free Soldering: Update 2000 (UK: Department of Trade and Industry, London, 2000)

3. M.R. Harrison, J.H. Vincent, H.A.H. Steen, Solder Surf. Mt. Tech. 13, 21 (2001)

4. B. Salam, N.N. Ekere, D. Rajkumar, Proc. 51st Electron. Comp. Technol. Conf. (Orlando, FL, May 2001), pp. 471–477

5. Z.G. Chen, Y.W. Shi, Z.D. Xia, J. Electron. Mater. 33, 964 (2004)

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