Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate-Reference-Cited by-同舟云学术

Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate

Published:2019-10-30 Issue:1 Volume:49 Page:257-267
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Liu Chia-Yu,Kuo Po-Cheng,Chen Chih-Ming,Dai Jia-Ying,Yen Yee-Wen,Pasana Alberto S.

Funder

Ministry of Science and Technology

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07752-z.pdf

Reference28 articles.

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3. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang, Mater. Sci. Eng. R 44, 1 (2004).

4. S.K. Kang, D.Y. Shih, D. Leonard, D.W. Henderson, T. Goesselin, S.I. Cho, J. Yu, and W.K. Choi, JOM 56, 34 (2004).

5. H. Hao, Y. Shi, Z. Xia, Y. Lei, and F. Guo, J. Electron. Mater. 37, 2 (2008).

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