1. D.Y.R. Chong, F.X. Che, J.H.L. Pang, K. Ng, J.Y.N. Tan, and P.T.H. Low, Microelectron. Reliab. 46, 1160–1171 (2006).
2. S. Liu, X.J. Wang, B. Ma, Z.Y. Gan, and H.H. Zhang, 6th International Conference on Electronics Packaging Technology (2005).
3. C.T. Lim and Y.J. Low, Proceedings—Electronic Components and Technology Conference (2003), pp. 113–120.
4. JEDEC standard JESD22-B110A. Subassembly Mechanical Shock Test.
5. JEDEC standard JESD22-B111. Board Level Drop Test Method of Components for Handheld Electronic Products.