Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders-Reference-Cited by-同舟云学术

Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

Published:2016-02-17 Issue:11 Volume:45 Page:5800-5810
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Li Qin,Ma Ninshu,Lei YongPing,Lin Jian,Fu HanGuang,Gu Jian

Funder

National Natural Science Foundation of China

Beijing Municipal Natural Science Foundation

Science Research Project of Beijing Municipal Education Commission

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-016-4366-z.pdf

Reference30 articles.

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2. L.R. Garcia, W.R. Osorio, L.C. Peixoto, and A. Garcia, J. Electron. Mater. 38, 2405 (2009).

3. Y.F. Yan and W.L. Wang, Lead-Free Solders in Electronic Assembly (in Chinese), 1st ed. (Beijing: Publishing House of Electronics Industry, 2010), p. 41.

4. L. Zhang, S.B. Xue, L.L. Gao, Z. Sheng, H. Ye, Z.X. Xiao, G. Zeng, Y. Chen, and S.L. Yu, J. Mater. Sci. 21, 2 (2010).

5. S.K. Lin, T.L. Nguyen, S.C. Wu, and Y.H. Wang, J. Alloys Compd. 586, 319 (2013).

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