Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders-Reference-Cited by-同舟云学术

Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders

Published:2007-09-22 Issue:1 Volume:37 Page:73-83
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yen Yee-Wen,Chou Weng-Ting,Tseng Yu,Lee Chiapyng,Hsu Chun-Lei

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0266-6.pdf

Reference27 articles.

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2. B. Trumble and J. Brydges, Electronics and the Environment, 1998. ISEE-1998. Proceedings of the 1998 IEEE International Symposium on (Oak Brook, IL: Institute of Electrical & Electronics Engineers, Inc., 1998)

3. A.Z. Miric, A. Girusd, Solder. Surf. Mount Technol., 10, 19 (1998)

4. Waste Electrical and Electronic Equipment, http://ec.europa. eu/environment/waste/weee/index_en.htm (2007)

5. J. Glazer, Int. Mater. Rev., 40, 65 (1995)

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