Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples
Author:
Affiliation:
1. National Taiwan University of Science and Technology,Department of Materials Science and Engineering,Taipei,Taiwan, R.O.C.,10672
Funder
Ministry of Science and Technology
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795609.pdf?arnumber=9795609
Reference11 articles.
1. Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
2. Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates
3. The Cu–Sn phase diagram part II: New thermodynamic assessment
4. Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
5. The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction
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1. Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates;Metals;2022-12-21
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