The Cu–Sn phase diagram part II: New thermodynamic assessment-Reference-Cited by-同舟云学术

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The Cu–Sn phase diagram part II: New thermodynamic assessment

Published:2013-03 Issue: Volume:34 Page:148-158
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

Li D.,Franke P.,Fürtauer S.,Cupid D.,Flandorfer H.

Funder

German Research Foundation

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference63 articles.

1. Microstructure evolution of eutectic Sn-Ag solder joints

2. The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders

3. Novel Core-Shell Sn-Cu Anodes for Lithium Rechargeable Batteries Prepared by a Redox-Transmetalation Reaction

4. Copper–tin anodes for rechargeable lithium batteries: an example of the matrix effect in an intermetallic system

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