Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders-Reference-Cited by-同舟云学术

Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

Published:2006-12 Issue:12 Volume:35 Page:2088-2097
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Dudek M. A.,Sidhu R. S.,Chawla N.,Renavikar M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-006-0318-3.pdf

Reference42 articles.

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5. A. Schubert, H. Walter, R. Dudek, B. Michel, G. Lefranc, J. Otto, and G. Mitic, Proc. Int. Symp. on Advanced Packaging Materials Processes, Properties and Interfaces (Piscataway, NJ: IEEE, 2001, pp. 129–134.

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