Effect of rare-element (Ga) addition on the microstructure and mechanical properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni lead-free solder alloys-Reference-Cited by-同舟云学术

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Effect of rare-element (Ga) addition on the microstructure and mechanical properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni lead-free solder alloys

Published:2019-12-19 Issue: Volume:701 Page:012031
ISSN:1757-899X
Container-title:IOP Conference Series: Materials Science and Engineering
language:
Short-container-title:IOP Conf. Ser.: Mater. Sci. Eng.

Author:

Nazri Sufian Firdaus,Salleh Mohd Arif Anuar Mohd

Publisher

IOP Publishing

Subject

General Medicine

Link

https://iopscience.iop.org/article/10.1088/1757-899X/701/1/012031/pdf

Reference26 articles.

1. Lead-free Solders in Microelectronics

2. Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles;Journal of Polytechnic;2023-08-15

2. Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry;Microelectronics Reliability;2022-08

3. Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method;Journal of Materials Science: Materials in Electronics;2021-07-28

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