A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder-Reference-Cited by-同舟云学术

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A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder

Published:2013-06-01 Issue:8 Volume:42 Page:2686-2695
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Ma Hai-Tao,Wang Jie,Qu Lin,Zhao Ning,Kunwar A.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-013-2615-y.pdf

Reference19 articles.

1. M. Abtew and G. Selvaduray, Mater. Sci. Eng., R 27, 95 (2000).

2. K.N. Tu and K. Zeng, Mater. Sci. Eng., R 34, 1 (2001).

3. K.N. Tu, A.M. Gusak, and M. Li, J. Appl. Phys. 93, 1335 (2003).

4. K. Suganuma, Curr. Opin. Solid State Mater. Sci. 5, 55 (2001).

5. M. Kamal and E.S. Gouda, Mater. Manuf. Process. 21, 736 (2006).

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3. Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding;Soldering & Surface Mount Technology;2019-09-02

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