Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards-Reference-Cited by-同舟云学术

Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

Published:2019-09-05 Issue:1 Volume:49 Page:48-58
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hong Won Sik^ORCID,Oh Chulmin

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07595-8.pdf

Reference19 articles.

1. T.X. Liang, Y.Q. Liu, Z.Q. Fu, T.Y. Luo, and K.Y. Zhang, Thin Solid Films 473, 247 (2005).

2. T. Takemoto, R.M. Latanision, T.W. Eagar, and A. Matsunawa, Corros. Sci. 39, 1415 (2009).

3. B.-I. Noh, J.W. Yoon, W.S. Hong, and S.B. Jung, J. Electron. Mater. 38, 902 (2009).

4. IPC-TM-650 2.6.13, Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring (Northbrook, IL: The Institute for Interconnecting and Packaging Electronic Circuits, 1985), pp. 1–2.

5. IPC-TR-476A, Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies (Northbrook, IL: The Institute for Interconnecting and Packaging Electronic Circuits, 1997), pp. 1–15.

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