Electrochemical Metallic Ion Migration Property of Multi-Layer Ceramic Capacitor for Car Electronics

Abstract

As the use of electrical components in automobiles increases, the occurrence of electorchemical metallic ion migration (ECM), which is one of the causes of various failures in electrical components, is also increasing. Therefore, in this study, 1608 MLCC chip components were used for temperature-humidity-bias (THB) tests at 65℃/85%R.H., 65℃/95%R.H., and 85℃/85%R.H. Three types of THB tests were conducted for 2,934 h. For the THB test, voltages of 3.3, 12 and 24 V were applied, and real-time resistance of MLCCs were measured at every 40 mms intervals. During the ECM test, the ECM occurrence time was measured by monitoring the insulation resistance of between the electrode of MLCC under each THB test conditions. The failure criteria for ECM occurrence were 106 Ω or less, and the time when it occurred more than twice was judged as the ECM failure criteria. Based on the ECM occurrence time, the mean life time of ECM occurrence according to temperature, humidity and applied voltage conditions was derived through Weibull statistical analysis. Finally, we compared and analyzed the sensitivity of MLCC components to ECM generation under use environment of automotive electronics.