Author:
Noh Bo-In,Yoon Jeong-Won,Hong Won-Sik,Jung Seung-Boo
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. T.X. Liang, Y.Q. Liu, Z.Q. Fu, T.Y. Luo, and K.Y. Zhang, Thin Solid Films 473, 247 (2005).doi: 10.1016/j.tsf.2004.07.073
2. P. Palm, J. Määttänen, Y.D. Maquillé, A. Picault, J. Vanfleteren, and B. Vandecasteele, Proceedings of the First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, Germany (2001), pp. 224–229
3. T. Takemoto, R.M. Latanision, T.W. Eagar, and A. Matsunawa, Corros. Sci. 39, 1415 (1997).doi: 10.1016/S0010-938X(97)00038-3
4. S.B. Lee, Y.R. Yoo, J.Y. Jung, Y.B. Park, Y.S. Kim, and Y.C. Joo, Thin Solid Films 504, 294 (2006).doi: 10.1016/j.tsf.2005.09.022
5. G. Harsányi, Mater. Chem. Phys. 44, 85 (1996).doi: 10.1016/0254-0584(95)01646-C
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