Author:
Huang M. L.,Wu C. M. L.,Wang L.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. J.W. Morris, Jr. and H.L. Reynolds, Design and Reliability of Solders and Solder Interconnections, ed. R.K. Madihara, S.M.L. Sastry, P.K. Liaw, K.L. Murty, D.R. Frear, and W.L. Winterbottom (Warrendale, PA: TMS, 1997), pp. 49–58.
2. H. Mavoori and S. Jin, JOM 52, 29 (2000).
3. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang, JOM 53, 28 (2001).
4. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M.E. Fine, J. Electron. Mater. 26, 783 (1997).
5. V.I. Igoshev and J.I. Kleiman, J. Electron. Mater. 29, 244 (2000).
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献