Effect of Rare Earth Pr on Creep Behavior of Sn-0.3Ag-0.7Cu-0.5Ga Low-Ag Solder Alloys-Reference-Cited by-同舟云学术

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Effect of Rare Earth Pr on Creep Behavior of Sn-0.3Ag-0.7Cu-0.5Ga Low-Ag Solder Alloys

Published:2018-09 Issue:9 Volume:47 Page:2657-2662
ISSN:1875-5372
Container-title:Rare Metal Materials and Engineering
language:en
Short-container-title:Rare Metal Materials and Engineering

Author:

Bo Wang,Songbai Xue,Jianxin Wang,Weimin Long,Qingke Zhang

Funder

National Natural Science Foundation of China

Priority Academic Program Development (PAPD) of Jiangsu Higher Education Institutions; China Postdoctoral Science Foundation

Publisher

Elsevier BV

Subject

General Medicine

Reference19 articles.

1. WEEE management in Europe and China – A comparison

2. Thermal Fatigue Behavior of SnAgCu Soldered Joints in Fine Pitch Devices

3. Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn–Ag–Cu solder alloy

4. Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates

5. Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder;Journal of Materials Science: Materials in Electronics;2024-07

2. Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection;RARE METAL MAT ENG;2023

3. Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders;Intermetallics;2022-11

4. Structure and properties of low-Ag SAC solders for electronic packaging;Journal of Materials Science: Materials in Electronics;2022-09-24

5. Effects of rare earth Ce addition on the microstructure and shear property of Cu/In-50Ag/Cu composite solder joint;Microelectronics Reliability;2021-12

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