Author:
Abd El-Rehim A. F.,Zahran H. Y.,Yassin A. M.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference27 articles.
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4. M.H. Mahdavifard, M.F.M. Sabri, S.M. Said, D.A. Shnawah, I.A. Badruddin, S. Rozali, Effects of Fe and Bi minor alloying on mechanical, thermal, and microstructural properties of Sn-0.7Cu solder alloy. J. Electron. Mater. 45, 3673 (2016)
5. L.F. Li, Y.K. Cheng, G.L. Xu, E.Z. Wang, Z.H. Zhang, H. Wang, Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders. Mater. Des. 64, 15 (2014)
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