Author:
Chan D.,Subbarayan G.,Nguyen L.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. T.L. Anderson, Fracture Mechanics: Fundamentals and Applications, 3rd edn. (Boca Raton, FL: Taylor and Francis, 2005).
2. P.C. Paris, M.P. Gomez, and W.E. Anderson, Trend Eng. 13, 9 (1961).
3. J. Lemaitre, Nucl. Eng. Des. 80, 233 (1983).
4. J.L. Chaboche, Nucl. Eng. Des. 105, 19 (1987).
5. L.P. Lehman, S.N. Athavale, T.Z. Fullem, A.C. Giamis, R. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Raie, J. Wang, Y. Xing, L. Zavalij, P. Borgesen, and E.J. Cotts, J. Electron. Mater. 33, 1429 (2004).
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