Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance-Reference-Cited by-同舟云学术

Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance

Published:2017-06-26 Issue:10 Volume:46 Page:6224-6233
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lee Tae-Kyu^ORCID,Chen Zhiqiang,Guirguis Cherif,Akinade Kola

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-017-5650-2/fulltext.html

Reference19 articles.

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4. H.G. Song, J.W. Morris Jr., and F. Hua, JOM 56, 30 (2002).

5. J. Savic, M. Nagar, W. Xie, M. Ahmad, D. Senk, A. Bansal, N. Islam, P. Oh, R. Pendse, H. Choi, and S.Lee, in Proceeding of IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, 450–456 (2012)

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