Reliability Testing Technology and Equiment for Interconnection between PCB and Chips-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Reliability Testing Technology and Equiment for Interconnection between PCB and Chips

Published:2024-02-27 Issue: Volume:35 Page:349-353
ISSN:
Container-title:2024 IEEE 3rd International Conference on Electrical Engineering, Big Data and Algorithms (EEBDA)
language:
Short-container-title:

Author:

He Shilie¹,Shi Linlin²,Chen Yiqiang³,Zhou Zhenwei³,Jia Hanguang³,Shen Limin⁴

Affiliation:

1. Northwestern Polytechnical University,Xi'an,China

2. Huangpu Institute of Materials,Guangzhou,China

3. The Fifth Electronics Research Institute of Ministry of Industry and Information Technology,Guangzhou,China

4. Department of Electrical Engineering Guangzhou Railway Polytechnic,Guangzhou,China

Funder

Ministry of Industry and Information Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10485650/10485652/10485998.pdf?arnumber=10485998

Reference6 articles.

1. Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance

2. Failure diagnosis of FPGA solder joint [J];WANG;Chinese Journal of Welding,2014

3. Design of BGA encapsulated FPGA solder joint failure diagnosis system[J];ZHONG;Computer Measurement and Control,2014

4. Design and Implementationstrategy of Board LEVEL BIST based on FPGA[J];DU;Computer Measurement and Control,2008

5. Design of EtherCAT Slave System Based on Zynq-7020 Chip

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP