Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating-Reference-Cited by-同舟云学术

Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating

Published:2017-03-02 Issue:7 Volume:46 Page:4321-4325
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hung H. T.,Yang S.,Chen Y. B.,Kao C. R.

Funder

Ministry of Science and Technology, Taiwan

National Taiwan University

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-017-5385-0/fulltext.html

Reference14 articles.

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2. C.R. Kao, H.Y. Chuang, W.M. Chen, T.L. Yang, M.S. Kuo, Y.J. Chen, J.J. Yu, and C.C. Li, in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 724 (2012)

3. K.N. Tu, H.Y. Hsiao, and C. Chen, Microelectron. Reliab. 53, 2 (2013).

4. K.N. Tu, Microelectron. Reliab. 51, 517 (2011).

5. Z. Tőkei, K. Croes, and G.P. Beyer, Microelectron. Eng. 87, 348 (2010).

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