Research on Electroplating Bonding of Flip-Chip Under the Action of Additives-Reference-Cited by-同舟云学术

Research on Electroplating Bonding of Flip-Chip Under the Action of Additives

Published:2023-08 Issue:8 Volume:13 Page:1324-1331
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Yang Haoze¹^ORCID,Wang Yong²,Chen Mingming¹^ORCID,Liu Junfu²,Liu Yunpeng²,Chen Taotao²,Li Junhui¹^ORCID

Affiliation:

1. State Key Laboratory of Precision Manufacturing for Extreme Service Performance Manufacturing and the School of Mechanical and Electrical Engineering, Central South University, Changsha, China

2. 43rd Research Institute, China Electronics Technology Group Corporation, Hefei, China

Funder

National Natural Science Foundation of China

National Natural Science Foundation of China’s Joint fund for Regional Innovation and Development

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10255328/10207684.pdf?arnumber=10207684

Reference32 articles.

1. Novel Cu-to-Cu Bonding With Ti Passivation at 180$^{\circ}{\rm C}$ in 3-D Integration

2. Cosputtered Cu/Ti Bonded Interconnects With a Self-Formed Adhesion Layer for Three-Dimensional Integration Applications

3. Cu-Cu Room Temperature Bonding - Current Status of Surface Activated Bonding(SAB) -

4. Cu-Cu bonding enhancement at low temperature by using carboxylic acid surface-modified Cu nanoparticles

5. Potential-dependence of additives distribution in copper electrodeposition via filling