Cu-Cu bonding enhancement at low temperature by using carboxylic acid surface-modified Cu nanoparticles-Reference-Cited by-同舟云学术

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Cu-Cu bonding enhancement at low temperature by using carboxylic acid surface-modified Cu nanoparticles

Published:2018-09 Issue: Volume:227 Page:179-183
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Mou Yun,Peng Yang,Zhang Yueru,Cheng Hao,Chen Mingxiang

Funder

Nature Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products

2. Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles

3. Low temperature bonding technology for 3D integration

4. Metal?metal bonding process using Ag metallo-organic nanoparticles

5. A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding

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