A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging-Reference-Cited by-同舟云学术

A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Huang Jeng-Hau¹,Shih Po-Shao¹,Shen Chang-Hsien¹,Renganathan Vengudusamy¹,Gräfner Simon Johannes¹,Lin Yu-Chun¹,Kao Chin-Li²,Lin Yung-Sheng²,Hung Yun-Ching²,Chiang Chun-Wei²,Kao C.R.¹

Affiliation:

1. National Taiwan University,Department of Materials Science and Engineeering,Taipei City,Taiwan

2. Product Characterization, Corporate R&D, Advanced Semiconductor Engineering (ASE) Group,Kaohsiung City,Taiwan

Funder

Ministry of Science and Technology of Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195761.pdf?arnumber=10195761

Reference12 articles.

1. Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

2. Materials Merging Mechanism of Microfluidic Electroless Interconnection Process

3. Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications

4. Highly uniform microfluidic electroless interconnections for chip stacking applications

5. Area-Selective Electroless Deposition of Cu for Hybrid Bonding

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