Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications-Reference-Cited by-同舟云学术

Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications

Published:2023-04 Issue: Volume:269 Page:118474
ISSN:0009-2509
Container-title:Chemical Engineering Science
language:en
Short-container-title:Chemical Engineering Science

Author:

Gräfner Simon Johannes,Huang Jeng-Hau^ORCID,Renganathan Vengudusamy^ORCID,Kung Po-Yu,Wu Po-Yi^ORCID,Kao C.R.

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Applied Mathematics,Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Reference42 articles.

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2. Bubble dislodgment in a capillary network with microscopic multichannels and multibifurcation features;Chao;Langmuir,2019

3. Effect of network structure on the bubble dislodgment and pressure distribution in microfluidic networks with multiple bifurcations;Chao;Chem. Eng. Sci.,2019

4. Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating;Chen,2022

5. Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip Packaging;Chen,2021

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