Author:
Park T.-S.,Dao M.,Suresh S.,Rosakis A.J.,Pantuso D.,Shankar S.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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3. Thermomechanical modeling of back-end-of-the-line 3D interconnects;2009 59th Electronic Components and Technology Conference;2009-05