1. D.R. Frear and P.T. Vianco, Metall. Mater. Trans. A 25, 1509 (1994).
2. A. Grusd, Proceedings of Surface Mount International Conference (Edina, MN, USA, 1998), p. 648.
3. Y. Kariya and W. J. Plumbridge, Proceedings 7th Symposium on Micro-joining and Assembly Technology in Electronics (Yokohama, Japan, 2001), p. 383.
4. P. Kumar, I. Dutta, V. Sarihan, D. R. Frear, and M. Renavikar, Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 11th (2008), p. 660.
5. P. Kumar, Z. Huang, and I. Dutta, Proceedings of InterPACK2009, Paper No. 89205 (IEEE/ASME), CD-ROM.