1. Chen, C. P. and Leipold, M. H. (1980). Fracture toughness of silicon. Ceramic Bulletin, 59(4):469–472.
2. Groothuis, S., Schroen, W. H., and Murtuza, M. (1985). Computer aided stress modelling for optimising package reliability. In Proc. 23 rd IEEE International Reliability Physics Symposium, pages 182–191.
3. Ito, S., Kuwamura, M., Sudo, S., and Mizutani, M. (1997). Study of encapsulating system for diversified area bump packages. In Proc. 47 th IEEE Electronic Component & Technology Conference, pages 46–53.
4. Kelly, G., Lyden, C., Lawton, W., Barrett, J., Saboui, A., Lamourelle, F., and Exposito, J. (1994). Accurate prediction of PQFP warpage. In Proc. 44 th IEEE Electronic Component & Technology Conference, pages 102–106.
5. Kelly, G., Lyden, C., Lawton, W., Barrett, J., Saboui, A., Pape, H., and Peters, H. (1996). The importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs. IEEE Transactions on Components Packaging and Manufacturing Technology — Part B, 19(2):296–300.