Study of encapsulating system for diversified area bump packages-Reference-Cited by-同舟云学术

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Study of encapsulating system for diversified area bump packages

Published: Issue: Volume: Page:
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Container-title:1997 Proceedings 47th Electronic Components and Technology Conference
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Author:

Ito S.,Kuwamura M.,Sudo S.,Mizutani M.,Fukushima T.,Noro H.,Akizuki S.,Prabhu A.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/4801/13278/00606141.pdf?arnumber=606141

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sub-70 nm resolution patterning of high etch-resistant epoxy novolac resins using gas permeable templates in ultraviolet nanoimprint lithography;Applied Physics Express;2016-04-15

2. Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substrates;IEEE Transactions on Electronics Packaging Manufacturing;2002-07

3. Measurement of water absorption in ball grid array package;IEEE Transactions on Components and Packaging Technologies;2002-03

4. Cure shrinkage analysis of epoxy molding compound;Polymer Engineering & Science;2001-08

5. A novel flip chip technology using nonconductive resin sheet;IEEE Transactions on Components and Packaging Technologies;1999-06

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