Author:
Groothuis Steven,Schroen Walter,Murtuza Masood
Cited by
15 articles.
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2. Accurate Prediction of PQFP Warpage;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999
3. The Correlation of Modelling with Measurements and Failure Modes;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999
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