ZrO2 Nanoparticle Embedded Low Silver Lead Free Solder Alloy for Modern Electronic Devices
Author:
Funder
National Research Foundation of Korea
Ajou University
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/article/10.1007/s13391-018-0089-z/fulltext.html
Reference33 articles.
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2. Zeng, K., Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R 38, 55 (2002)
3. Sharma, A., Das, S., Das, K.: Pulse electrodeposition of lead-free tin-based composites for microelectronic packaging. In: Mohamed, A.M.A. (ed.) Electrodeposition of Composite Materials, pp. 253–274. InTech, Croatia (2016). https://doi.org/10.5772/62036 . http://www.intechopen.com
4. Suganuma, K.: Advances in lead-free electronics soldering. Curr. Opin. Solid State. Mater. 5, 55 (2001)
5. Sharma, A., Das, S., Das, K.: Pulse electroplating of ultrafine grained tin coating. In: Aliofkhazraei, M. (ed.) Electroplating of Nanostructures, pp. 105–129. InTech, Croatia (2015). https://doi.org/10.5772/61255
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