Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging-Reference-Cited by-同舟云学术

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Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Published:2016-03-23 Issue: Volume: Page:
ISSN:
Container-title:Electrodeposition of Composite Materials
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Author:

Sharma Ashutosh,Das Siddhartha,Das Karabi

Publisher

InTech

Link

http://www.intechopen.com/download/pdf/49897

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics;Journal of Materials Science;2022-05

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