More-than-Moore Technology Opportunities: 2.5D SiP-Reference-Cited by-同舟云学术

More-than-Moore Technology Opportunities: 2.5D SiP

Published:2017 Issue: Volume: Page:5-67
ISSN:
Container-title:More-than-Moore 2.5D and 3D SiP Integration
language:
Short-container-title:

Author:

Radojcic Riko

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-319-52548-8_2

Reference30 articles.

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2. AMD (2016) High Bandwidth Memory, Reinventing Memory Technology. http://www.amd.com/en-us/innovations/software-technologies/hbm . Accessed 24 Nov 2016

3. Black B (2012) Sie stacking and the system. In: IEEE hot chips HC24, Aug 2012

4. Chen YH et al (2014) Low cost glass interposer development. In: International symposium on microelectronics, vol 2014, No 1

5. Corning (2016) Corning semiconductor glass wafer products. https://www.corning.com/worldwide/en/products/advanced-optics/product-materials/semiconductor-laser-optic-components/semiconductor-glass-wafers.html . Accessed 24 Nov 2016

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