Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure

Author:

Shang Yuling,Sun LiyuanORCID,Li Chunquan,Ma Jianfeng

Funder

National Natural Science Foundation of China

Innovation Project of GUET Graduate Education

Guangxi Key Laboratory of Automation Test and Instrumentation

Graduate Research Project of Education Department of Guangxi

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Neural Network Optimization and Data Fusion Recognition Method for Intelligent Mechanical Fault Diagnosis;Journal of Sensors;2021-09-29

2. TSV fault contactless testing method based on group delay;International Journal of Electronics;2021-02-16

3. Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC;Journal of Electronic Testing;2020-12

4. TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither;Journal of Advanced Computational Intelligence and Intelligent Informatics;2019-01-20

5. A Low Power Online Test Method for FPGA Single Solder Joint Resistance;Journal of Electronic Testing;2017-12

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