TSV fault contactless testing method based on group delay-Reference-Cited by-同舟云学术

TSV fault contactless testing method based on group delay

Published:2021-02-16 Issue:9 Volume:108 Page:1570-1589
ISSN:0020-7217
Container-title:International Journal of Electronics
language:en
Short-container-title:International Journal of Electronics

Author:

Shang Yuling¹,Zhao Yamin¹,Li Chunquan²,Tan Min¹,Zeng Lizhen³

Affiliation:

1. Department of Electronic Engineering and Automation, Guilin University of Electronic Technology, Guilin, China

2. Department of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China

3. Department of Information and Communication, Guilin University of Electronic Technology, Guilin, China

Funder

National Natural Science Foundation of China

Guangxi Natural Science Foundation of China

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/00207217.2020.1870735

Reference33 articles.

1. Degradation of BER by Group Delay in Digital Phase Modulation

2. Contactless Test Access Mechanism for TSV-Based 3-D ICs Utilizing Capacitive Coupling

3. 3DIC developments for high yield and reliability manufacturing

4. An optimization algorithm for pre-bond TSV probing tests and fault localization

5. A scan-based pre-bond test of through-silicon vias with open and short defects

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