Heterogeneous Integration: Building the Foundation for Innovative Products-Reference-Cited by-同舟云学术

Heterogeneous Integration: Building the Foundation for Innovative Products

Published:2009 Issue: Volume: Page:279-303
ISSN:
Container-title:More than Moore
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Author:

Reichl Herbert,Aschenbrenner Rolf,Töpper Michael,Pötter Harald

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-0-387-75593-9_9.pdf

Reference19 articles.

1. AEPT Final Report, NCMS (Ed.), Ann Arbor, MI, 2003

2. Shift (Smart High-Integration Flex Technologies), http://www.vdivde-it.de/portale/shift/default.html

3. L. Böttcher, A. Neumann, A. Ostmann, H. Reichl, Integration of Active and Passive Components Using Chip in Polymer Technology, Proceedings SMTA International Conference 2005, Chicago, Ilinois, 2005

4. R.K. Ulrich, L.W. Schaper, Integrated Passive Component Technology, Wiley-Interscience, New York, 2003

5. R. Aschenbrenner, A. Ostmann, A. Neumann, H. Reichl, Process flow and manufacturing concept for embedded active devices, Proceedings of EPTC 2004, Singapore, December 8–10, 2004

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