Integrated Passive Component Technology

Author:

Ulrich Richard K.,Schaper Leonard W.

Publisher

John Wiley & Sons, Inc.

Cited by 61 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. High Yield Design of an On Chip X-band Power Divider Based on GaAs IPD Technology;2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON);2023-12-11

2. Modeling and Simulation of Discrete Silicon Carbide Integrated Passive Devices in High-Power RF Amplifiers;2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS);2023-10-16

3. A Robust Integrated Power Delivery Methodology for 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-03

4. The planar anodic Al 2 O 3 -ZrO 2 nanocomposite capacitor dielectrics for advanced passive device integration;Science and Technology of Advanced Materials;2023-02-13

5. Introduction to Nanoparticle-Based Integrated Passives;Nano-Bio- Electronic, Photonic and MEMS Packaging;2021

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